As the number of applications needing mass quantities of storage continues to grow (think mobile devices, wearables, automotive, enterprise…you get the picture) – so too does the need for powerful memory solutions.
From high density BiCS FLASH™ 3D flash memory and low power, high bandwidth TSV to industrial SLC and everything in between, our product lineup is purposefully designed to support applications that require a variety of features. These features include high reliability, high temperature, high performance and high endurance.
In the latest video from our Design Insight Series, I’ll highlight Toshiba Memory’s focus on bringing solutions to market that enable the development of products that keep pace with the fast moving storage market.
After all - who better to lead flash memory into the future than the company that invented it?
Click here to learn more: http://www.toshiba.com/tma/technologymoves/design-insights.jsp
Notes: BiCS FLASH is a trademark of Toshiba Memory Corporation.
The views and opinions expressed in this blog are those of the author(s) and do not necessarily reflect those of Toshiba Memory America, Inc.