Artificial intelligence. Cognitive computing. Augmented and virtual reality. Automotive. IoT . Edge computing and storage. What does our BiCS FLASH™ 3D flash memory have to do with these exciting, emerging fields?
Already enabling the enterprise, data center, PC and mobile applications of today, TMA's BiCS FLASH has paved the way for the applications that will turn possibilities into realities. Storage density needs are continually climbing higher and higher - and BiCS FLASH was designed with this in mind. By vertically stacking layers and layers of memory cells, we’re able to offer the new levels of storage capacity, density, performance and reliability that emerging applications require.
One way that we are doing this is by accelerating package density capability. For example, our 512Gb die in a 16 die stack has made a 1TB solution possible – in a single package. And that’s just for triple-level-cell (TLC)-based 3D flash memory – an even denser package is enabled using our quadruple-level cell (QLC) BiCS FLASH - 2.66 terabytes, to be exact. Because it goes without saying: The more data that can be stored in one physical space, the better.
BiCS FLASH is pushing the boundaries of memory. We’ve reached 96 layers – and we’re not done yet. Ongoing advances to our 3D flash memory lineup mean that the sky is the limit.
Notes: BiCS FLASH is a trademark of Toshiba Memory Corporation.
Definition of capacity: Toshiba Memory Corporation defines a gigabyte (GB) as 1,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
Information, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of publication, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
The views and opinions expressed in this blog are those of the author(s) and do not necessarily reflect those of Toshiba Memory America, Inc.